Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications

Year of publication

2014

Authors

Putaala, Jussi; Salmela, Olli; Nousiainen, Olli; Kangasvieri, Tero; Vähäkangas, Jouko; Uusimäki, Antti; Lappalainen, Jyrki

Organizations and authors

University of Oulu

Nousiainen Olli

Uusimäki Antti Kauko

Vähäkangas Jouko Kaarlo

Putaala Jussi

Lappalainen Jyrki Henrik Juhani

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Soldering and surface mount technology

Issue

Pages

117-128

ISSN

0954-0911

Publication forum

67371

Publication forum level

Open access

Open access in the publisher’s service

Self-archived

Other information

Fields of science

Electronic, automation and communications engineering, electronics; Mechanical engineering; Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Publication country

United Kingdom

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

Unknown

DOI

10.1108/SSMT-07-2013-0018

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes