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Thermal Nanoimprint Lithography—A Review of the Process, Mold Fabrication, and Material

Year of publication

2023

Authors

Unno, Noriyuki; Mäkelä, Tapio

Abstract

<p>Micro- and nanopatterns perform unique functions and have attracted attention in various industrial fields, such as electronic devices, microfluidics, biotechnology, optics, sensors, and smart and anti-adhesion surfaces. To put fine-patterned products to practical use, low-cost patterning technology is necessary. Nanoimprint lithography (NIL) is a promising technique for high-throughput nanopattern fabrication. In particular, thermal nanoimprint lithography (T-NIL) has the advantage of employing flexible materials and eliminating chemicals and solvents. Moreover, T-NIL is particularly suitable for compostable and recyclable materials, especially when applying biobased materials for use in optics and electronics. These attributes make T-NIL an eco-friendly process. However, the processing time of normal T-NIL is longer than that of ultraviolet (UV) NIL using a UV-curable resin because the T-NIL process requires heating and cooling time. Therefore, many studies focus on improving the throughput of T-NIL. Specifically, a T-NIL process based on a roll-to-roll web system shows promise for next-generation nanopatterning techniques because it enables large-area applications with the capability to process webs several meters in width. In this review, the T-NIL process, roll mold fabrication techniques, and various materials are introduced. Moreover, metal pattern transfer techniques using a combination of nanotransfer printing, T-NIL, and a reverse offset are introduced.</p>
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Organizations and authors

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Volume

13

Issue

14

Article number

2031

​Publication forum

82604

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Fully open publication channel

License of the publisher’s version

CC BY

Self-archived

No

Other information

Fields of science

Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Language

English

International co-publication

Yes

Co-publication with a company

No

DOI

10.3390/nano13142031

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes