Experimentally Verified, Fast Analytic and Numerical Design of Superconducting Resonators in Flip-Chip Architectures
Year of publication
2023
Authors
Li, Hang Xi; Shiri, Daryoush; Kosen, Sandoko; Rommel, Marcus; Chayanun, Lert; Nylander, Andreas; Rehammar, Robert; Tancredi, Giovanna; Caputo, Marco; Grigoras, Kestutis; Gronberg, Leif; Govenius, Joonas; Bylander, Jonas
Abstract
<p>In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture. In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here we present a method, based on conformal mapping techniques, to predict a resonator&#x0027;s parameters directly from its 2D cross-section, without computationally heavy and time-consuming 3D simulation. We demonstrate the method&#x0027;s validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies, for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the inter-chip spacing.</p>
Show moreOrganizations and authors
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Journal/Series
Volume
4
Article number
3101312
ISSN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
Yes
Open access of publication channel
Fully open publication channel
License of the publisher’s version
CC BY
Self-archived
No
Other information
Fields of science
Computer and information sciences; Physical sciences; Electronic, automation and communications engineering, electronics; Mechanical engineering
Keywords
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Language
English
International co-publication
Yes
Co-publication with a company
No
DOI
10.1109/TQE.2023.3302371
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes