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Experimentally Verified, Fast Analytic and Numerical Design of Superconducting Resonators in Flip-Chip Architectures

Year of publication

2023

Authors

Li, Hang Xi; Shiri, Daryoush; Kosen, Sandoko; Rommel, Marcus; Chayanun, Lert; Nylander, Andreas; Rehammar, Robert; Tancredi, Giovanna; Caputo, Marco; Grigoras, Kestutis; Gronberg, Leif; Govenius, Joonas; Bylander, Jonas

Abstract

<p>In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture. In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here we present a method, based on conformal mapping techniques, to predict a resonator&amp;#x0027;s parameters directly from its 2D cross-section, without computationally heavy and time-consuming 3D simulation. We demonstrate the method&amp;#x0027;s validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies, for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the inter-chip spacing.</p>
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Organizations and authors

VTT Technical Research Centre of Finland Ltd

Govenius Joonas Orcid -palvelun logo

Grigoras Kestutis

Gronberg Leif Orcid -palvelun logo

Caputo Marco

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Volume

4

Article number

3101312

​Publication forum

90543

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Fully open publication channel

License of the publisher’s version

CC BY

Self-archived

No

Other information

Fields of science

Computer and information sciences; Physical sciences; Electronic, automation and communications engineering, electronics; Mechanical engineering

Keywords

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Language

English

International co-publication

Yes

Co-publication with a company

No

DOI

10.1109/TQE.2023.3302371

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes