Packaging of Photonic Integrated Circuits: Extended Abstract
Year of publication
2023
Authors
Karppinen, Mikko
Organizations and authors
VTT Technical Research Centre of Finland Ltd
Karppinen Mikko
Publication type
Publication format
Abstract
Parent publication type
Conference
Audience
Scientific
Publication channel information
Parent publication name
2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2023)
Conference
IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2023
Publisher
IEEE Institute of Electrical and Electronic Engineers
ISBN
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Fields of science
Electronic, automation and communications engineering, electronics
Keywords
[object Object],[object Object],[object Object],[object Object],[object Object]
Language
English
International co-publication
No
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
No