undefined

< Back to search results

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Year of publication

2024

Authors

Golim, Obert; Vuorinen, Vesa; Wernicke, Tobias; Pawlak, Marta; Paulasto-Kröckel, Mervi

Organizations and authors

Aalto University

Paulasto-Kröckel Mervi Orcid -palvelun logo

Golim Obert Orcid -palvelun logo

Vuorinen Vesa Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal

Microelectronic Engineering

Publisher

Elsevier

Volume

286

Article number

112140

ISSN

0167-9317

​Publication forum

63335

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Other information

Fields of science

Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Yes

Co-publication with a company

Yes

DOI

10.1016/j.mee.2024.112140

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes