(poster) New Method for Ohmic Metal to Si Contact Formation Utilizing Highly Charged ALD Dielectric.
Year of publication
2024
Authors
Lahtiluoma, Lassi; Setälä, Olli; Vähänissi, Ville; Savin, Hele
Organizations and authors
Publication type
Publication format
Abstract
Parent publication type
Conference
Audience
Scientific
Open access
Open access in the publisher’s service
No
Self-archived
Yes
Other information
Fields of science
Materials engineering
Keywords
[object Object],[object Object],[object Object],[object Object]
Internationality of the publisher
Domestic
Language
English
International co-publication
No
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
No