Electromigration Reliability of Cu<sub>3</sub>Sn Microbumps for 3D Heterogeneous Integration

Year of publication

2024

Authors

Tiwary, Nikhilendu; Grosse, Christian; Kögel, Michael; Windemuth, Thilo; Ross, Glenn; Vuorinen, Vesa; Brand, Sebastian; Paulasto-Kröckel, Mervi

Organizations and authors

Aalto University

Ross Glenn

Paulasto-Kröckel Mervi

Tiwary Nikhilendu

Windemuth Thilo

Vuorinen Vesa

Publication type

Publication format

Article

Parent publication type

Conference

Article type

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A4 Article in conference proceedings

Publication channel information

Open access

Open access in the publisher’s service

Self-archived

Yes

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

Cu-Sn SLID bonding; ELECTROMIGRATION; failure analysis; FE simulations; Heterogeneous integration

Internationality of the publisher

International

Language

English

International co-publication

Yes

Co-publication with a company

DOI

10.1109/ESTC60143.2024.10712054

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes