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Cyclic Bending Reliability and Failure Mechanism of Printed Biodegradable Flexible Supercapacitor on Polymer Substrate

Year of publication

2022

Authors

Fu, Zhao; Hannula, Markus; Jauho, Aarne; Väisänen, Kaisa Leena; Välimäki, Marja; Keskinen, Jari; Mäntysalo, Matti

Abstract

<p>A flexible supercapacitor (SC) is an attractive energy storage device for powering low-power sensors, since it can be built using only nontoxic and sustainable materials. In this study, the advantages of using biodegradable polylactic acid (PLA) substrate for printed SC are investigated by studying the SC's cyclic bending reliability, failure mechanism, and the impact of the bending radius. The results confirm that the SCs with laminated PLA with polymer barrier substrate exhibited the highest bending reliability, stability, and capability in preventing liquid electrolyte evaporation among the investigated substrates. Besides, the reliability decreased with the decreasing bending radius only when the strongly impacted areas lie on the electrode, the flaking and cracking of which was found to be the failure mechanisms of the tested SCs, except for the SCs with PLA/Al substrate, which failed due to the Al cracking. This research suggests that using PLA/barrier substrate, developing more robust activated carbon electrodes, developing cellulose paper with more dense fiber structure and smaller porous areas, and controlling the bending radius are crucial to improving the SC's reliability.</p>
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Organizations and authors

Tampere University

Keskinen Jari Orcid -palvelun logo

Mäntysalo Matti Orcid -palvelun logo

Fu Zhao

Hannula Markus

VTT Technical Research Centre of Finland Ltd

Väisänen Kaisa Leena

Välimäki Marja Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Volume

14

Issue

35

Pages

40145-40157

​Publication forum

50178

​Publication forum level

2

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Other information

Fields of science

Electronic, automation and communications engineering, electronics; Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1021/acsami.2c08502

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes