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Contact Metallization Design for Low-Temperature Interconnects in MEMS Integration

Open access
Emadi, Fahimeh
Aalto University2024

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2024.3430061
Emadi, Fahimeh; Vuorinen, Vesa; Liu, Shenyi; Paulasto-Krockel, Mervi
IEEE Transactions on Components, Packaging and Manufacturing Technology2024

Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Peer-reviewed
Open access
DOI
10.1109/ESTC.2018.8546398
Vuorinen, Vesa; Ross, Glenn; Viljanen, Heikki; Decker, James; Paulasto-Krockel, Mervi
7th Electronic System-Integration Technology Conference, ESTC 20182018

Introduction to Encapsulation and Integration of MEMS

Peer-reviewed
DOI
10.1016/B978-0-323-29965-7.00028-2
Kuisma, Heikki; Paulasto-Kröckel, Mervi
Elsevier2015

MEMS-4-MMIC: Merging RF-MEMS switches & MMIC

Peer-reviewed
Baggen, R.; Malmqvist, R.; Smith, D.; Vähä-Heikkilä, Tauno; Simon, W.
5th ESA Workshop on Millimetre Wave Technology and Applications and 31st ESA Antenna Workshop2010

Solid-liquid interdiffusion bonding for MEMS device integration

Open access
Rautiainen, Antti
Aalto University2018

MEMS-radio yhdelle piisirulle

Peer-reviewed
Oja, Aarne; Alastalo, A.; Knuuttila, J.V.; Räisänen, Antti V.; Tittonen, Ilkka; Kallio, A.; Salomaa,...
Prosessori2003

MEMS based impedance tuners

Peer-reviewed
Vähä-Heikkilä, Tauno; Rintamäki, Markus; Varis, Jussi; Tuovinen, Jussi
Politecnico di Torino2005

Analysis of a MEMS transmission line

Peer-reviewed
DOI
10.1109/TMTT.2003.815270
Alastalo, A.T.; Mattila, T.; Seppä, H.
IEEE Transactions on Microwave Theory and Techniques2003

Capacitive RF MEMS power sensors

Peer-reviewed
Vähä-Heikkilä, Tauno; Kyynäräinen, Jukka; Dekker, James; Pekko, Panu; Guillaume, Nadine; Oja, Aarne;...
ESA Conference Proceedings2003

Contact Metallization Design for Low-Temperature Interconnects in MEMS Integration

Open access
2024

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2024.3430061
2024

Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Peer-reviewed
Open access
DOI
10.1109/ESTC.2018.8546398
2018

Introduction to Encapsulation and Integration of MEMS

Peer-reviewed
DOI
10.1016/B978-0-323-29965-7.00028-2
2015

MEMS-4-MMIC: Merging RF-MEMS switches & MMIC

Peer-reviewed
2010

Solid-liquid interdiffusion bonding for MEMS device integration

Open access
2018

MEMS-radio yhdelle piisirulle

Peer-reviewed
2003

MEMS based impedance tuners

Peer-reviewed
2005

Analysis of a MEMS transmission line

Peer-reviewed
DOI
10.1109/TMTT.2003.815270
2003

Capacitive RF MEMS power sensors

Peer-reviewed
2003