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Diffusion barriers in semiconductor contact metallization: Dissertation

Kattelus, Hannu
Technical Research Centre of Finland. Publications1988

Contact Metallization Design for Low-Temperature Interconnects in MEMS Integration

Open access
Emadi, Fahimeh
Aalto University2024

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Peer-reviewed
Open access
DOI
10.1109/ESTC55720.2022.9939539
Emadi, Fahimeh; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings2022

The effect of platinum contact metallization on Cu/Sn bonding

Peer-reviewed
Open access
DOI
10.1007/s10854-018-9663-2
Rautiainen, Antti; Ross, Glenn; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi
Journal of Materials Science: Materials in Electronics2018

Reactively sputtered Ta2N and TaN diffusion barriers for copper metallization

Peer-reviewed
Molarius, Jyrki; Laurila, Tomi; Riekkinen, Tommi; Zeng, Kejun; Niskanen, Antti; Leskelä, Markku; Sun...
Advanced Metallization Conference2000

Current knowledge on biomarkers for contact sensitization and allergic contact dermatitis

Peer-reviewed
DOI
10.1111/cod.12789
Koppes SA; Engebretsen KA; Agner T; Angelova-Fischer I; Berents T; Brandner J; Brans R; Clausen ML; ...
Contact Dermatitis2017

Local aspects of hydrogen-induced metallization of the ZnO(10-10) surface

Peer-reviewed
Open access
DOI
10.1103/PhysRevB.91.235313
Deinert, J. C.; Hofmann, O. T.; Meyer, Michael; Rinke, P.; Stähler, J.
Physical Review B2015

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

Peer-reviewed
Open access
DOI
10.1016/j.jallcom.2022.167228
Emadi, F.; Vuorinen, V.; Mertin, Stefan; Widell, K.; Paulasto-Kröckel, M.
Journal of alloys and compounds2022

Print Quality in Contact and Non-Contact Fixing

Peer-reviewed
Sipi, K.; Lamberg, M.; Oittinen, P.
-1999

Metallization of organically modified ceramics for microfluidic electrochemical assays

Peer-reviewed
Open access
DOI
10.3390/mi10090605
Bonabi, Ashkan; Tähkä, Sari; Ollikainen, Elisa; Jokinen, Ville; Sikanen, Tiina
Micromachines2019

Diffusion barriers in semiconductor contact metallization: Dissertation

1988

Contact Metallization Design for Low-Temperature Interconnects in MEMS Integration

Open access
2024

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Peer-reviewed
Open access
DOI
10.1109/ESTC55720.2022.9939539
2022

The effect of platinum contact metallization on Cu/Sn bonding

Peer-reviewed
Open access
DOI
10.1007/s10854-018-9663-2
2018

Reactively sputtered Ta2N and TaN diffusion barriers for copper metallization

Peer-reviewed
2000

Current knowledge on biomarkers for contact sensitization and allergic contact dermatitis

Peer-reviewed
DOI
10.1111/cod.12789
2017

Local aspects of hydrogen-induced metallization of the ZnO(10-10) surface

Peer-reviewed
Open access
DOI
10.1103/PhysRevB.91.235313
2015

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

Peer-reviewed
Open access
DOI
10.1016/j.jallcom.2022.167228
2022

Print Quality in Contact and Non-Contact Fixing

Peer-reviewed
1999

Metallization of organically modified ceramics for microfluidic electrochemical assays

Peer-reviewed
Open access
DOI
10.3390/mi10090605
2019